Leading edge solutions for AI-ML Accelerator and Chip-Chip communications
Novel Light Sources at lower cost, greater flexibility and the ability to scale for high volume optical computing applications

Data and Telecommunications

Disruptive solutions which significantly reduce size and cost of optical
data and telecommunications interconnects


True CMOS-compatible wafer-level fabrication, assembly and test and
provides cost-efficient high-performance solutions for integrating
photonics and ASICs

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POET's Vision

Our vision for the company is to become the global leader in chip-scale photonic solutions by deploying our Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications.



A focus on creative disruption

As a company, POET Technologies has always been focused on the disruptive potential of its technology. Applying our knowledge of the design and fabrication of active photonic devices and optical waveguides with a deep understanding of semiconductor fabrication techniques we have created the first-ever wafer-level integration of electronics and photonics into a single device  –  the POET Optical Interposer.


With all fabrication, assembly, alignment, testing, burn-in and packaging done at wafer-level, the POET Optical Interposer achieves the lowest cost of integrating electronics and photonics, with unparalleled scalability.


 The POET Optical Interposer is a platform technology providing maximum flexibility and scalability. Both electronic and photonic devices are fabricated into the layers of the Optical Interposer at wafer-level, eliminating active alignment and allowing high-speed communication among all devices. Substituting devices or changing form factors is done with minimal design changes to the platform allowing Optical Interposer-based solutions to span multiple product generations and a wide variety of applications.


The POET Optical Interposer is fabricated in a wafer-level process that is completely compatible with standard CMOS semiconductor processing, making it the solution to a long-sought-after means to co-packaged optics – building photonics communications capability directly into a chip – for high speed computing and networking applications.