POET Optical Interposer Platform™

Innovative wafer-level integration of Photonics and Electronics enabling
next-generation Opto-electronic Solutions

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Data and Telecommunications

Disruptive solutions which significantly reduce size and cost of optical
data and telecommunications interconnects

CO-PACKAGED OPTICS

True CMOS-compatible wafer-level fabrication, assembly and test and
provides cost-efficient high-performance solutions for integrating
photonics and ASICs

POET's Vision

Our vision for the company is to become the global leader in chip-scale photonic solutions by deploying our Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications.

 

 

A focus on creative disruption

As a company, POET Technologies has always been focused on the disruptive potential of its technology. Applying our knowledge of the design and fabrication of active photonic devices and optical waveguides with a deep understanding of semiconductor fabrication techniques we have created the first-ever wafer-level integration of electronics and photonics into a single device  –  the POET Optical Interposer.

 

With all fabrication, assembly, alignment, testing, burn-in and packaging done at wafer-level, the POET Optical Interposer achieves the lowest cost of integrating electronics and photonics, with unparalleled scalability.

 

 The POET Optical Interposer is a platform technology providing maximum flexibility and scalability. Both electronic and photonic devices are fabricated into the layers of the Optical Interposer at wafer-level, eliminating active alignment and allowing high-speed communication among all devices. Substituting devices or changing form factors is done with minimal design changes to the platform allowing Optical Interposer-based solutions to span multiple product generations and a wide variety of applications.

 

The POET Optical Interposer is fabricated in a wafer-level process that is completely compatible with standard CMOS semiconductor processing, making it the solution to a long-sought-after means to co-packaged optics – building photonics communications capability directly into a chip – for high speed computing and networking applications.