Our vision for the company is to become the global leader in chip-scale photonic solutions by deploying our Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications.
As a company, POET Technologies has always been focused on the disruptive potential of its technology. Applying our knowledge of the design and fabrication of active photonic devices and optical waveguides with a deep understanding of semiconductor fabrication techniques we have created the first-ever wafer-level integration of electronics and photonics into a single device – the POET Optical Interposer.
With all fabrication, assembly, alignment, testing, burn-in and packaging done at wafer-level, the POET Optical Interposer achieves the lowest cost of integrating electronics and photonics, with unparalleled scalability.
The POET Optical Interposer is a platform technology providing maximum flexibility and scalability. Both electronic and photonic devices are fabricated into the layers of the Optical Interposer at wafer-level, eliminating active alignment and allowing high-speed communication among all devices. Substituting devices or changing form factors is done with minimal design changes to the platform allowing Optical Interposer-based solutions to span multiple product generations and a wide variety of applications.
The POET Optical Interposer is fabricated in a wafer-level process that is completely compatible with standard CMOS semiconductor processing, making it the solution to a long-sought-after means to co-packaged optics – building photonics communications capability directly into a chip – for high speed computing and networking applications.